"Marco recognizes what 'Added Value' is all about. They are prepared to rise to the challenge, you are guaranteed results with the very first contact."
- Corporate Quality Director, TDI |
The Facts
 Responsiveness is our strength!
Services provided:
Prototype to high volume assembly and test of printed circuit assemblies, sub-assemblies, and box build.
Materials management on a consignment, turn-key or partial turn-key/consignment basis.
Process capabilities include:
Plated thru hole, Surface mount (SMT), Double-sided Fine Pitch SMT, BGA, Micro BGA, Chip Scale Packages, In-Circuit test, Functional Test and Burn-In.
Versatile, conscientious work force - averaging over 10 years of experience in electronics manufacturing.
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